Process for the metallization of nonconductive substrates with e

Details Process for the metallization of nonconductive substrates with e Process for the metallization of nonconductive substrates with e

1993-09-03

1995-06-06

Niebling, John

Electrolysis: processes, compositions used therein, and methods

Electrolytic coating

Coating predominantly nonmetal substrate

205159, 205160, 205163, 205188, C25D 554

Patent

active

054219892

ABSTRACT:
A process for applying a principal metal coating to a non-conductive substrate without employing an electroless coating is disclosed comprising:

REFERENCES:
patent: 2702253 (1955-02-01), Bergstrom
patent: 3011920 (1961-12-01), Shipley, Jr.
patent: 3099608 (1963-07-01), Radovsky
patent: 3984290 (1976-10-01), Kitaev et al.
patent: 4631117 (1986-12-01), Minten et al.
patent: 4634468 (1987-01-01), Gulla et al.
patent: 4652311 (1987-03-01), Gulla et al.
patent: 4683036 (1987-07-01), Morrissey et al.
patent: 4725314 (1988-02-01), Gulla et al.
patent: 4810333 (1989-03-01), Gulla et al.
patent: 4891069 (1990-01-01), Holtzman et al.
patent: 4895739 (1990-01-01), Bladon
patent: 4969979 (1990-11-01), Appelt et al.
patent: 5071517 (1991-12-01), Oabayashi
patent: 5145572 (1992-09-01), Hupe et al.
Harnden, "A System For Direct Plating", North East Circuits Association Technical Conference, Mar. 19, 1992.

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