Metal fusion bonding – Process – Preplacing solid filler
Reexamination Certificate
2007-05-29
2007-05-29
Johnson, Jonathan (Department: 1725)
Metal fusion bonding
Process
Preplacing solid filler
C228S120000, C228S194000
Reexamination Certificate
active
10451703
ABSTRACT:
The invention relates to a process for the metallization with a silicon alloy melting at a temperature T1 of certain zones of the surface of a part made of an oxide ceramic unable to be wetted by the said alloy, the said process comprising, in succession, a step of depositing carbon on the said zones of the said part that are to be metallized, a step of depositing the silicon alloy in solid form on at least one portion of the said part, so that the said alloy has at least one point of contact with the said zones to be metallized, followed by a heating step at a temperature greater than or equal to T1, the said alloy gathering in the molten state on the said zones to be metallized.This process applies also to the brazing of parts, at least one of which is a part made of an oxide ceramic unable to be wetted by the said alloy.Application of the said processes to the fields of electronics, electrical engineering, thermal engineering and chemical engineering.
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Chaumat Valérie
Pagano Carole
Commissariat a l''Energie Atomique
Johnson Jonathan
McKenna Long & Aldridge LLP
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