Process for the material-abrading machining of the edge of a sem

Details Process for the material-abrading machining of the edge of a sem Process for the material-abrading machining of the edge of a sem

1997-08-05

2000-04-04

Rose, Robert A.

Abrading

Abrading process

Glass or stone abrading

451 41, 451 57, 451 58, 451443, B24B 906

Patent

active

060454369

ABSTRACT:
In a process for the material-abrading machining of the edge of a semiconductor wafer, the semiconductor wafer is resting on a rotationally movable table, is rotated about a central axis and is machined by a plurality of rotating machining tools. It is intended for each of the machining tools to abrade a specific quantity of material from the edge of the semiconductor wafer. The process is one in which the machining tools, during the course of a 360.degree.-rotation of the semiconductor wafer, are successively advanced toward the edge of the semiconductor wafer and ultimately simultaneously machine the edge of the semiconductor wafer. A machining tool which has just been advanced is intended to abrade a smaller quantity from the edge of the semiconductor wafer than a previously advanced machining tool. The machining of the edge of the semiconductor wafer with one machining tool is terminated at the earliest once the semiconductor wafer has rotated through 360.degree., calculated from the advancement of this machining tool.

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