Process for the manufacture of semiconductor wafers with a rear

Details Process for the manufacture of semiconductor wafers with a rear Process for the manufacture of semiconductor wafers with a rear

1983-10-19

1985-09-03

Hearn, Brian E.

Metal treatment

Compositions

Heat treating

29576B, 29576T, 148 332, 148DIG60, H01L 21268

Patent

active

045390509

ABSTRACT:
For the manufacture of semiconductor wafers with a rear side having a geting action in subsequent oxidation processes by means of the action of light, especially laser, radiation ("laser damage"), there are advantageously chosen wafers with a fine surface structure that contains faces that are inclined by at least 15.degree. in the actual profile by comparison with the geometrically ideal profile of the surface according to known standards. As a result, in comparison to smooth surfaces, considerable savings in energy and time are achieved.

REFERENCES:
patent: 3905162 (1975-09-01), Lawrence et al.
patent: 4131487 (1978-12-01), Pearce et al.
patent: 4144099 (1979-03-01), Edmonds et al.
patent: 4257827 (1981-03-01), Schwuttke et al.
patent: 4276114 (1981-06-01), Takano et al.
patent: 4319119 (1982-03-01), Runge

Affiliated with

Also associated with

Rating

Process for the manufacture of semiconductor wafers with a rear does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Process for the manufacture of semiconductor wafers with a rear , we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Process for the manufacture of semiconductor wafers with a rear will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-611972