Process for the manufacture of printed circuits using electropho

Details Process for the manufacture of printed circuits using electropho Process for the manufacture of printed circuits using electropho

1993-01-19

1994-02-22

Niebling, John

Chemistry: electrical and wave energy

Processes and products

Electrostatic field or electrical discharge

2041816, 2041817, 205188, 205197, C25D 1320

Patent

active

052883779

ABSTRACT:
Copper surfaces upon which organic resins are electrophoretically deposited to serve as plating or etch resists in the course of manufacturing printed circuits, are preliminarily provided with a uniformizing/passivating coating layer, such as a layer of copper oxide or phosphate conversion coating, over which the organic resin is electrophoretically deposited, resulting in the organic resin being deposited with substantial uniformity in thickness and properties.

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