Process for the manufacture of printed circuits

Adhesive bonding and miscellaneous chemical manufacture – Methods – Surface bonding and/or assembly therefor

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

156234, 156241, 1562739, B32B 3126

Patent

active

048592633

ABSTRACT:
A method for manufacturing printed electrical circuits which comprise a substrate and copper foil applied thereto by hot embossing in a predetermined circuit pattern, said method comprising

REFERENCES:
patent: 2776235 (1957-01-01), Peck
patent: 2925645 (1960-02-01), Bell
patent: 3497410 (1970-02-01), Zagusta
patent: 3547724 (1970-12-01), Zagusta
patent: 4081653 (1978-03-01), Koo
patent: 4372798 (1983-02-01), Dalton
patent: 4427716 (1984-01-01), Siwek
patent: 4465538 (1984-08-01), Schmoock
patent: 4525233 (1985-06-01), Brooks
patent: 4568413 (1986-02-01), Toth
patent: 4710253 (1987-12-01), Soszek

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Process for the manufacture of printed circuits does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Process for the manufacture of printed circuits, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Process for the manufacture of printed circuits will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-2416047

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.