Process for the manufacture of multi-layer particle board using

Details Process for the manufacture of multi-layer particle board using Process for the manufacture of multi-layer particle board using

1983-12-05

1985-06-25

Childs, S. L.

Adhesive bonding and miscellaneous chemical manufacture

Methods

Surface bonding and/or assembly therefor

1563073, 1563088, 156335, 264112, 264113, 428529, B29J 500, B32B 1700

Patent

active

045252270

ABSTRACT:
A process for the manufacture of triple- and multi-layer particle board employing phenol formaldehyde resin compositions for gluing particles in the outer layers of the board characterized by the use of a phenol formaldehyde resin composition having a viscosity of about 30-90 seconds (4-mm DIN cup), a solids content of between about 30 and 39 percent by weight and an alkali content of less than 8 percent by weight is provided.

REFERENCES:
patent: 3076772 (1963-02-01), Christ
patent: 3108990 (1963-10-01), Baxter
patent: 3864291 (1975-02-01), Enkist
patent: 3931072 (1976-01-01), Coyle
patent: 3968308 (1976-07-01), Buschfeld et al.
patent: 4105606 (1978-08-01), Forss et al.

Affiliated with

Also associated with

Rating

Process for the manufacture of multi-layer particle board using does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Process for the manufacture of multi-layer particle board using , we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Process for the manufacture of multi-layer particle board using will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-553183