Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor
Reexamination Certificate
2006-08-22
2006-08-22
Nelms, David (Department: 2818)
Semiconductor device manufacturing: process
Packaging or treatment of packaged semiconductor
C438S106000, C438S049000, C438S101000
Reexamination Certificate
active
07094627
ABSTRACT:
Electrostatic printing methods are used to allow the precise placement of small, discrete components on a substrate. The components are configured as liquid toners by coating one or more surfaces with a charge control agent which reacts with a charge director in a diluent to create a charge on the coated components allowing them to be manipulated and placed using electrical fields.
REFERENCES:
patent: 6361912 (2002-03-01), Fonash et al.
Electrox Corporation
Nelms David
Nguyen Thinh T
Synnestvedt Lechner & Woodbridge LLP
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