Process for the manufacture of integrated capacitive transducers

Details Process for the manufacture of integrated capacitive transducers Process for the manufacture of integrated capacitive transducers

1993-11-05

1995-04-25

Vo, Peter Dungba

Metal working

Electric condenser making

29594, 29847, 3612831, H01G 700, H04R 3100

Patent

active

054087317

ABSTRACT:
The process notably consists of assembling by welding by means of a connecting layer (16) a first (10) and a second substrate (12) of a semiconductor material, of thinning the second substrate (12) and, for each of the transducers, of structuring this second thinned substrate (12) to form a network of orifices (24) and of defining the contour of the fixed electrode of the transducer, of etching the first substrate (10) to form the diaphragm (28) of the transducer, and of eliminating the part of the connecting layer (16) which is located between the diaphragm (28) and the network of orifices (24) to separate this diaphragm (28) from the fixed electrode.
The invention has applications in the manufacture of transducers such as microphones.

REFERENCES:
patent: 4513348 (1985-08-01), Grantham
patent: 4615105 (1986-10-01), Wada et al.
patent: 4910840 (1990-03-01), Sprenkels et al.
patent: 5211058 (1993-05-01), Fukiura et al.
"Silicon in mechanical sensors", Journal of Physics E. Scientific Instruments, vol. 1, No. 12, Dec. 1988, Bristol, Great Britain, pp. 1114-1128.
"Mikrosensoren und-aktoren Schone kleine Welt", Technische Rundschau, vol. 83, No. 36, 6 Sep. 1991, Bern, Switzerland, pp. 72-75.

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