Process for the manufacture of chip boards using condensation re

Details Process for the manufacture of chip boards using condensation re Process for the manufacture of chip boards using condensation re

1974-12-16

1976-07-06

Hoag, Willard E.

Stock material or miscellaneous articles

Coated or structually defined flake, particle, cell, strand,...

Particulate matter

156 622, 156284, 156307, 264113, 264122, 264126, 428525, B29J 500, D21J 118

Patent

active

039683087

ABSTRACT:
The present invention relates to a process for the manufacture of chip boards especially multi-layer chip boards, using condensation resins as binders, and the products thereof the improvement including wetting powdered adhesive particles before applying the adhesive particles to wood chips.

REFERENCES:
patent: 2711381 (1955-06-01), Novotny et al.
patent: 3061878 (1961-11-01), Chapman
patent: 3391233 (1968-07-01), Polovtseff
patent: 3435106 (1969-03-01), Hager

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