Chemistry of carbon compounds – Miscellaneous organic carbon compounds
Patent
1979-08-02
1981-01-27
Welsh, Maurice J.
Chemistry of carbon compounds
Miscellaneous organic carbon compounds
C08L 2706
Patent
active
042474388
ABSTRACT:
Aqueous ethylene/vinyl chloride/vinyl alkanoate and/or alkyl acrylate copolymer dispersions having a non-uniform particle size distribution, in which one particle size distribution maximum is at 0.03 to 0.2.mu. and a second maximum is at 0.15 to 1.mu. and in which 5% to 60% by weight of the particles belong to the amount of particles having said second maximum, which are produced by free-radical polymerization at 0.degree. to 90.degree. C., while stirring, in the presence of emulsifiers which, in amounts of 0.5% to 15% by weight, calculated on the final solid resin, are not added until a polymerization conversion of 1% to 60% by weight of the total amount of monomer has been reached. The copolymer dispersions have solids contents of 20% to 70% by weight of copolymer comprising 20% to 92% by weight of vinyl chloride, 5% to 60% by weight of ethylene and 3% to 75% by weight of vinyl esters and/or acrylic acid esters, and, optionally, up to 15% by weight of other monomers copolymerizable with ethylene and vinyl chloride, said monomers being metered into the polymerization mixture together with the emulsifiers during the manufacturing process.
REFERENCES:
patent: 3632542 (1972-01-01), Fox et al.
patent: 3639326 (1972-02-01), Kray et al.
patent: 3830761 (1974-08-01), Lenney
Eck Herbert
Hafener Klaus
Wiest Hubert
Wacker-Chemie GmbH
Welsh Maurice J.
LandOfFree
Process for the manufacture of aqueous ethylene/vinyl chloride/v does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Process for the manufacture of aqueous ethylene/vinyl chloride/v, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Process for the manufacture of aqueous ethylene/vinyl chloride/v will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-1180826