Process for the manufacture of an interconnecting substrate for

Details Process for the manufacture of an interconnecting substrate for Process for the manufacture of an interconnecting substrate for

1986-07-10

1988-10-04

Derrington, James

Plastic and nonmetallic article shaping or treating: processes

Including step of generating heat by friction

264 65, 156 89, 29830, C04B 3564

Patent

active

047755032

ABSTRACT:
A process is disclosed for forming an interconnecting substrate for electronic components based on a cordierite ceramic, the substrate having a relatively small dielectric coefficient, allowing use in ultra high frequency applications. In one embodiment, the substrate is prepared from a powder which is sintered at approximately 980 degrees, allowing coatings of silver heated in an oxidizing atmosphere, or copper heated in a reducing atmosphere. In another embodiment, the powder is sintered at approximately 1350.degree. C., allowing coatings of a palladium base heated in an oxidizing atmosphere or molybdenum or tungsten base heated in reducing atmosphere.

REFERENCES:
patent: 4234367 (1980-11-01), Herron et al.
patent: 4301324 (1981-11-01), Kumar et al.
patent: 4641425 (1987-02-01), Dubuisson et al.

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