Metal working – Method of mechanical manufacture – Assembling or joining
Patent
1984-10-10
1986-05-13
Roy, Upendra
Metal working
Method of mechanical manufacture
Assembling or joining
29571, 29576B, 29576J, 148 15, 148175, 148187, 148DIG91, H01L 21324, H01L 21265
Patent
active
045877203
ABSTRACT:
The process consists in producing the grid (4) of the transistor on a glass substrate (2), depositing an insulating layer (6) on the substrate and grid, depositing a thick layer (8) of hydrogenated amorphous silicon on the insulating layer, depositing on the silicon layer a layer (10) of positive photosensitive resin sensitive to light of a wavelength greater than 550 nm, irradiating the resin layer through the substrate, the grid serving as a mask for the irradiation, developing the resin, etching the silicon layer until the insulating layer is bared, the remanent resin serving as a mask for the etching, depositing the layers permitting the making of the electrical contacts and the electrodes of the source and of the drain, eliminating the remanent resin (10a), and etching the electrodes of the source and of the drain.
REFERENCES:
patent: 4380864 (1983-04-01), Das
patent: 4398343 (1983-08-01), Yamazaki
patent: 4456490 (1984-06-01), Dutta et al.
IEEE Electron Device Letters, vol. EDL-3, No. 7, juillet 1982, New York (US).
T. Kodama et al: "Self-Alignment Process for Amorphous Silicon Thin Film Transistors", pp. 187-189 *pp. 187, 188, Alinea 2; FIG. 1*.
Sid International Symposium-Digest of Technical Papers, Edition 1, avril 1980, Lewis Winner, Coral Gables, Florida, (US).
E. Lueder: "Processing of Thin Film Transistors With Photolithography and Application for Displays", pp. 118, 119.
Chenevas-Paule Andre
Diem Bernard
Commissariat a l''Energie Atomique
Roy Upendra
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