Metal fusion bonding – Process – Metal to nonmetal with separate metallic filler
Patent
1989-03-23
1990-09-11
Seidel, Richard K.
Metal fusion bonding
Process
Metal to nonmetal with separate metallic filler
228124, 228239, 39890054, 39890129, 251368, B23K10316
Patent
active
049555227
ABSTRACT:
A process for the leakproof joining of a ceramic sealing disk, which regulates the passage of a fluid, and metallic attachments which are presented to the disk, wherein a roughly finished ceramic disk is metallized at the points that are to be joined to the metallic attachment (for example, a copper pipe with flanged-on collar) and soldered at the metallized points to the metallic attachment. The metallic attachment may also be joined to the ceramic sealing disk without prior metallization if an active solder is used. In one embodiment, the sliding and sealing face is produced on the side of the disk facing away from the metallic attachment by grinding and/or lapping and/or polishing. Alternatively, the sliding and sealing face can also be first produced on the roughly finished sealing disk by grinding and/or lapping and/or polishing and joined to the metallic attachment by applying the metallization and soldering, or by active soldering, and then cooling at a rate of more than 30 K/min.
REFERENCES:
patent: 3874635 (1975-04-01), Fletcher et al.
patent: 3901772 (1975-08-01), Guillotin et al.
patent: 4111178 (1978-09-01), Casey
patent: 4420142 (1983-12-01), Dworak et al.
patent: 4575047 (1986-03-01), Boos et al.
patent: 4736772 (1988-04-01), Ostertag et al.
Berichte der deutschem keramischen Gesellschaft, 42 (1965, pp. 452-454).
Werkstoffe & Konstruktion, vol. 1, No. 1, 1987, pp. 16-21.
Heinrich Samuel M.
Hoechst Ceramtec Aktiengesellschaft
Seidel Richard K.
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