Process for the immersion deposition of gold

Details Process for the immersion deposition of gold Process for the immersion deposition of gold

1981-06-02

1983-02-22

Hayes, Lorenzo B.

Coating processes

Immersion or partial immersion

Chemical compound reducing agent utilized

106 123, 106 126, 427437, C23C 302

Patent

active

043748767

ABSTRACT:
An electroless plating process for depositing gold on substrates, such as metal and metallized substrates, which involves immersing the substrates in an electroless plating bath composed of a trivalent gold complex, an organic carboxylic acid, and/or a mineral acid sufficient in amount so that the pH of the bath will range from about 0.1 to 6.0. The process of utilizing said electroless bath to deposit gold on the aforementioned substrates is also disclosed and claimed.

REFERENCES:
patent: 2836515 (1958-05-01), McNally
patent: 2995473 (1961-08-01), Levi
patent: 3214292 (1965-10-01), Edson
patent: 3589916 (1971-06-01), McCormack
patent: 3598706 (1971-08-01), Freedman et al.
patent: 3697296 (1972-10-01), Bellis
patent: 3700469 (1972-10-01), Okinaka
patent: 3862850 (1975-01-01), Trueblood
patent: 3917885 (1975-11-01), Baker
patent: 3993808 (1976-11-01), Inaba et al.
patent: 4168214 (1979-09-01), Fletcher et al.
Rich, Proc. Amer. Electroplat. Soc., 58 (1971).
Okinaka et al, Plating, 58 (1971) p. 1080.

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