Optical waveguides – With disengagable mechanical connector – Optical fiber to a nonfiber optical device connector
Patent
1993-08-16
1994-06-14
Bovernick, Rodney B.
Optical waveguides
With disengagable mechanical connector
Optical fiber to a nonfiber optical device connector
385147, 359900, G02B 636
Patent
active
053217861
ABSTRACT:
Process for the hybridization and positioning of an optoelectronic component on a substrate and application of this process to the positioning of a laser diode with respect to an optical guide. This process consists of forming on the substrate at least one abutment (16), which determines by fitting in at least one notch (34) formed on the component to be hybridized, the lateral positioning of said component, forming shims (24) on the substrate (6), whose height fixes the vertical positioning of the component (2), the latter being provided with pads or studs (32) of a first material, forming studs or pads (26) of a second material on the substrate, forming on the pads of the second material a welding chip (28) made from a meltable material able to wet in the melted state the first and second materials and not the area round them, positioning the component in contact with the welding chip in such a way that the abutment (16) is fitted into the notch (34) and the welding chip (28) faces the pad not provided with a chip, raising the assembly to the melting point of the chips and bringing the assembly to a temperature below the melting point thereof.
REFERENCES:
patent: 4270134 (1981-05-01), Takeda et al.
patent: 4861128 (1989-08-01), Ishikawa et al.
patent: 5023881 (1991-06-01), Ackerman et al.
patent: 5131584 (1992-07-01), Boitel et al.
patent: 5230030 (1993-07-01), Hartman et al.
Journal of Lightwave Technology, vol. 10, No. 3, Mar., 1992, New York, USA, pp. 336-340; E. E. L. Friedrich et al.: "Hybrid Integration of Semiconductor Lasers with Si-Based Single-Mode Ridge Waveguides".
Patent Abstracts of Japan, vol. 10, No. 41 (P-429) (2098) Feb. 18, 1986 & JP-A-60 188 913 (Matsushita Denki Sangyo K.K.) Sep. 26, 1985.
IEEE Transactions on Components, Hybrids, and Manufacturing Technology, vol. 13, No. 4, Dec., 1990, New York U.S., pp. 780-786; M. J. Wale et al.: "Self-Aligned Flip-Chip Assembly of Photonic Devices with Electric and Optical Connections".
Frequenz, vol. 45, No. 9-10, Sep. 1991, Berlin, DE, pp. 245-252, J. Muller et al.: "trench Bulge Waveguides for Integrated Optical Circuits".
Sensors and Actuators, vol. A23, No. 1-3, Mar., 1990, Lausanne, CH, pp. 1087-1091, S. Valette et al.: Silicon Based Integrated Optics Technology for Optical Sensor Applications.
L'Echo des Recherches No. 130, 1987, J. C. Bouley, pp. 59-68, "Evolution and Future Prospects of Laser Structures in Telecommunication", 1987.
Destefanis Gerard
Ravetto Michel
Valette Serge
Bovernick Rodney B.
Commissariat a l''Energie Atomique
Ngo John
LandOfFree
Process for the hybridization and positioning of an optoelectron does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Process for the hybridization and positioning of an optoelectron, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Process for the hybridization and positioning of an optoelectron will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-1255486