Metal treatment – Process of modifying or maintaining internal physical... – Magnetic materials
Patent
1998-05-21
1999-08-10
Sheehan, John
Metal treatment
Process of modifying or maintaining internal physical...
Magnetic materials
H01F 114, C21D 104
Patent
active
059353465
ABSTRACT:
Process for the heat treatment, in a magnetic field, of a magnetic component made of a low-anisotropy soft magnetic material such as, for example, a 15/80/5 FeNiMo alloy, an amorphous Co-based alloy or a nanocrystalline FeSiCuNbB alloy, in which the magnetic component is annealed at a temperature below the Curie point of the magnetic material and, during the annealing, the magnetic component is subjected to a DC or AC, unidirectional, longitudinal or transverse magnetic field, in which process the magnetic field is applied in the form of a succession of pulses each comprising a first part during which the intensity of the magnetic field reaches a maximum value and a second part during which the intensity of the magnetic field has a minimum value.
REFERENCES:
patent: 3887401 (1975-06-01), Hetzel
patent: 4379004 (1983-04-01), Makino et al.
patent: 4639278 (1987-01-01), Makino et al.
patent: 4816965 (1989-03-01), Drits
patent: 4873605 (1989-10-01), Drits et al.
patent: 4950337 (1990-08-01), Li et al.
patent: 5503686 (1996-04-01), Okamura et al.
Y. Yoshizawa, et al.; Effects Of Magnetic Field Annealing On Magnetic Properties In Ultrafine Crystalline Fe-Cu-Nb-Si-B Alloys; Sep. 1, 1989; vol. 25, No. 5, pp. 3324-3326.
Couderchon Georges
Verin Philippe
MECAGIS
Sheehan John
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