Process for the formation of anisotropic conducting material

Details Process for the formation of anisotropic conducting material Process for the formation of anisotropic conducting material

1997-08-13

1999-05-11

Mayes, Curtis

Adhesive bonding and miscellaneous chemical manufacture

Methods

Surface bonding and/or assembly therefor

156253, 156289, 427290, 439 66, 439 91, B32B31/18

Patent

active

059024380

ABSTRACT:
A process for the preparation of an anisotropic conducting material including the steps of providing a strip or sheet of a non-conducting matrix and laminating at least one layer of a release material to each side thereof to form a composite matrix, forming an array of holes in a predetermined pattern in the composite matrix, passing the matrix through a coating head which simultaneously fills the holes in the array in the composite matrix from both sides of the matrix with a conducting material, curing or drying the composite filled matrix and removing at least one layer of release material from each side of the matrix.

REFERENCES:
patent: 4008300 (1977-02-01), Ponn
patent: 4020206 (1977-04-01), Beil
patent: 5041183 (1991-08-01), Nakamura et al.
patent: 5049085 (1991-09-01), Reylek et al.
patent: 5136359 (1992-08-01), Takayama et al.
patent: 5188702 (1993-02-01), Takayama et al.
patent: 5216807 (1993-06-01), Yoshizawa et al.
patent: 5379515 (1995-01-01), Kondo et al.
patent: 5509203 (1996-04-01), Yamashita
patent: 5529504 (1996-06-01), Greenstein et al.
patent: 5531942 (1996-07-01), Gilleo et al.
patent: 5624268 (1997-04-01), Maeda et al.
patent: 5667884 (1997-09-01), Bolger
patent: 5681647 (1997-10-01), Caillat
patent: 5698496 (1997-12-01), Fastnacht et al.
patent: 5805424 (1998-09-01), Purington
patent: 5805425 (1998-09-01), Peterson
Characterization of a Polymeric, Area Array, Z-Axis Interconnect Film Adhesive for Microelectronic Assembly, M. Corey et al., of Alpha Metals, Inc.; and D. Baghurst, et al., of Cookson Technology Centre.

Affiliated with

Also associated with

Rating

Process for the formation of anisotropic conducting material does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Process for the formation of anisotropic conducting material, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Process for the formation of anisotropic conducting material will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-243747