Process for the fabrication of thermal printing boards in multil

Details Process for the fabrication of thermal printing boards in multil Process for the fabrication of thermal printing boards in multil

1983-11-09

1986-12-30

Bueker, Richard

Coating processes

Electrical product produced

Integrated circuit, printed circuit, or circuit board

427101, 427102, 427103, 4271262, 4273835, 4274193, B05D 512

Patent

active

046328459

ABSTRACT:
A process for fabricating electronic switching elements and/or circuits in multilayer thick-film technology on a substrate. The electronic switching elements and/or circuits are printed onto the substrate in the form of liquid or pasty mixtures of materials, then heat-treated, whereupon at least one insulating layer is deposited on the thick-film conducting layer. In this process, the surface of any desired insulating interlayer is finished abrasively and subsequently again at least one thick-film conducting layer or at least one insulating layer is deposited on the finished surface. Then, the surface or this insulating layer is again finished abrasively in subsequent printing operations of thick-film conducting layers or in other insulating layers in order to provide upon completion each layer at least the same processing ingredients and conditions as those on the surface of the substrate.

REFERENCES:
patent: 4138605 (1979-02-01), Stapleton et al.
patent: 4401881 (1983-08-01), Saito

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