Chemistry: electrical and wave energy – Processes and products
Patent
1976-09-13
1977-10-11
Tufariello, T. M.
Chemistry: electrical and wave energy
Processes and products
204 15, 204231, C25D 104, C25D 120
Patent
active
040533700
ABSTRACT:
A metal surface such as an endless strip of stainless steel is masked with a plating resist, leaving exposed areas to form a desired circuit pattern. The circuit pattern comprising a high density major layer and a roughened surface layer is formed by copper electroplating on the masked metal surface as same is made cathodic in a copper sulfate bath and successively held opposite to first and second insoluble anodes therein. In order to realize a high copper deposition rate, the electrolyte is caused to flow turbulently at an elevated temperature through the spacings between the metal surface and the first and second anodes. The completed circuit pattern has its roughened surface layer bonded to an adhesive-coated strip of insulating base and is separated from the metal surface. If desired, an adhesive-coated strip of overlay may then be bonded to the circuit pattern on the insulating base strip. The complete process can be automated.
REFERENCES:
patent: 3414487 (1968-12-01), Helms et al.
patent: 3674656 (1972-07-01), Yates
patent: 3799847 (1974-03-01), Vladimirovna
patent: 3984598 (1976-10-01), Sarazin et al.
Okamura Yukio
Safranek William H.
Wada Tatsuo
Yamashita Keizo
Koito Manufacturing Company Limited
Oujevolk George B.
Tufariello T. M.
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