Process for the fabrication of a structural and optical element

Details Process for the fabrication of a structural and optical element Process for the fabrication of a structural and optical element

1994-02-14

1997-09-16

Dang, Thi

Etching a substrate: processes

Forming or treating mask used for its nonetching function

216 58, 216 60, 216 67, 216 72, 216 76, 216 65, 216 66, B05D 500

Patent

active

056677006

ABSTRACT:
A process for the fabrication of a structural element, in particular an optical element comprises a carrier substrate as well as a layer system, with at least one dielectric layer stepped with respect to its thickness in at least one region opposite at least one second region. The dielectric layer is of the type MeO.sub.x and is applied onto a base, where Me is a metal whose atomic mass is at least 44, and x is selected so that the coefficient of absorption of the layer material at light of wavelength .lambda.=308 nm is k.sub.308 .ltoreq.0.01. The layer is built up through reactive etching by means of an activated gas for the step formation of the thickness. Other related processes and examples of the elements themselves are also disclosed.

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J.P. Lehan et al., Optical and Microstructural Properties of Hafnium Dioxide Thin Films, Elsevier Sequoia (1991).

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