Process for the electrolytic removal of polyimide resins

Details Process for the electrolytic removal of polyimide resins Process for the electrolytic removal of polyimide resins

1990-04-11

1990-11-06

Tufariello, T. M.

Chemistry: electrical and wave energy

Processes and products

Electrostatic field or electrical discharge

C25F 500

Patent

active

049683985

ABSTRACT:
When a copper-polyimide substrate which has been prepared by forming an electrolessly plated copper layer on a polyimide resin, and heat treated at a temperature of 120.degree. C. and 420.degree. C., is used to make a tape for tape automated bonding (TAB), any unwanted portion of the resin is dissolved in a solution containing hydrazine hydrate, whereby the copper layer is partially exposed. Then, electrolysis is conducted by using the exposed copper layer as a cathode and an insoluble anode to cause gas to rise from the cathode to thereby remove any undesirably remaining polyimide resin from the substrate.

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