Process for the deposition of metals on semiconductor powders

Details Process for the deposition of metals on semiconductor powders Process for the deposition of metals on semiconductor powders

1985-09-26

1986-10-28

Newsome, John H.

Coating processes

Electrical product produced

Welding electrode

20415715, 427 541, 427217, B05D 306

Patent

active

046198385

ABSTRACT:
Copper, lead, mercury, tin, gold, silver, palladium, osmium and/or cadmium can be deposited by photoredox reaction on semiconductor sulfide powders by irradiating a suspension of semiconductor sulfide powder in the presence of oxygen and optionally CO.sub.2, of an oxidizable system which optionally protects the semiconductor from photocorrosion, and of a salt or complex of copper, lead, mercury, tin, gold, silver, palladium, osmium and/or cadmium.

REFERENCES:
patent: 3907566 (1975-09-01), Inoue et al.
patent: 4264421 (1981-04-01), Bard et al.
L. Kulynych et al, IBM Technical Disclosure Bulletin, 23, 1262 (1980).

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