Process for the currentless metallization of electrically non-co

Details Process for the currentless metallization of electrically non-co Process for the currentless metallization of electrically non-co

1997-09-08

1999-08-03

Pianalto, Bernard

Coating processes

Direct application of electrical, magnetic, wave, or...

Polymerization of coating utilizing direct application of...

427304, 427322, 427404, 4274431, 427558, 427581, C08F 248

Patent

active

059323000

DESCRIPTION:

BRIEF SUMMARY
BACKGROUND OF THE INVENTION

1. Field of the Invention
The invention concerns a process for the currentless metallization of electrically non-conductive substrates on polymer base with a layer of UV hardenable lacquer, containing an organo-metallic palladium compound.
2. Description of the Related Art
Processes for the currentless metallization of electrically non-conductive substrates are known. Such a process is explained, for example, in the EP-PS 0 255 012 B1. For this process, an activator formulation containing a bonding agent is deposited on the electrically non-conductive substrate as carrier layer for the metallization. The solvent is removed from the activator formulation, which contains metal compounds in addition to bonding agents and solvents. The activator formulation is then reduced, and the substrate is metallized without current in a generally known metallization bath. The disadvantage of the known process is that the adhesion of the metallization on the substrate is not sufficient for all application cases, e.g. for the production of strip conductors with an extremely small reference grid.


SUMMARY OF THE INVENTION

In contrast, the advantage of the process according to the invention is that it is possible to obtain a metallization of extremely fine structures with high adhesiveness when the substrate is treated with UV radiation, for which the wavelength, time interval and radiation intensity can be selected, such that oxygen compounds of the polymer or the polymers develop on the substrate surface. Owing to the fact that a positive lacquer containing organic metal compounds is applied to the substrate, that the positive lacquer is subsequently irradiated with UV light and the metallization is precipitated onto the irradiated positive lacquer, it is advantageously possible to produce metallization structures with high adhesiveness, which can be reproduced in large piece numbers. The process according to the invention does not include a heat-intensive process step, so that even heat-sensitive substrates onto which the metallization is deposited can be used.
One preferred embodiment of the invention provides that the irradiation with UV light occurs at a specific wave length that can be selected and/or during a specific time interval that can be selected. The subsequent precipitating of the metallization onto the irradiated positive lacquer can be influenced advantageously through the selection of the wave length and the time interval for the irradiation. The metallization can thus be adjusted in such a way that an intermediate metal oxide layer is deposited first, on which the actual metallization then builds up. In this way, a high adhesiveness of the metallization on the substrate is achieved without requiring an additional intermediate step, meaning the intermediate layer and the main layer are precipitated during one operation. Metallization layers that adhere particularly well can be produced on the substrate, especially with use of a short-wave UV light according to the invention.
Another preferred embodiment of the invention provides that electrical strip conductors are produced through metallization in a copper bath. Owing to the high adhesiveness of the metallizations on the substrate, it is possible to produce extremely complex circuits, which can have a high cross-linkage in a small space. A distance between two strip conductors can be kept very small. It is furthermore preferable if electrical resistors are produced through metallization in a nickel or nickel-alloy bath. It is easy to produce highly adhesive electrical resistors in circuit arrangements with this method, which can be incorporated in the total production process for a printed circuit board by using a process step that is easily mastered.
Further advantageous embodiments of the invention follow from the remaining features specified in the dependent claims.


BRIEF DESCRIPTION OF THE DRAWINGS

The invention is explained in the following in more detail with the embodiments and the associated drawings. Shown in:
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REFERENCES:
IBM Technical Disclosure Bulletin, Metallizing Nonconductive Substrates, Haines, vol. 8, No. 9, Feb. 1966.

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