Process for the back-surface grinding of wafers

Details Process for the back-surface grinding of wafers Process for the back-surface grinding of wafers

2005-10-25

2005-10-25

Schillinger, Laura M (Department: 2813)

Semiconductor device manufacturing: process

Making device or circuit responsive to nonelectrical signal

Responsive to electromagnetic radiation

C438S051000, C438S054000

Reexamination Certificate

active

06958256

ABSTRACT:
The present invention relates to a process for the back-surface grinding of wafers using films which have a support layer, which is known per se, and an adhesion layer which can be polymerized in steps, and to films which include such an adhesion layer which can be polymerized in steps, and to the use thereof.

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