Process for the application of solder composition on the pins of

Details Process for the application of solder composition on the pins of Process for the application of solder composition on the pins of

1992-12-22

1995-07-18

Rosenbaum, Mark

Metal fusion bonding

Process

With protecting of work or filler or applying flux

228219, B23K 3538, B23K 3102

Patent

active

054333725

ABSTRACT:
A solder composition is applied to the pins of an electronic component. The pins of the component are brought into contact with solder at a soldering station having a bath exposed to a controlled atmosphere of low oxygen content maintained in a hood enclosing at least the surface of the bath. The controlled atmosphere is comprised of at least one neutral gas and a gaseous silicon hydride whose content is between 50.times.10.sup.-6 and 2.times.10.sup.-3 of the volume of the controlled atmosphere. The controlled atmosphere is produced:

REFERENCES:
patent: 4576659 (1986-03-01), Lewis et al.
patent: 4646958 (1987-03-01), Howard, Jr.
patent: 5048746 (1991-09-01), Elliott et al.
patent: 5071058 (1991-12-01), Nowotarski

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