Process for the adhesion-activation of polyamide substrates for

Details Process for the adhesion-activation of polyamide substrates for Process for the adhesion-activation of polyamide substrates for

1984-10-26

1986-02-04

Hoffman, James R.

Coating processes

With pretreatment of the base

Preapplied reactant or reaction promoter or hardener

427304, B05D 304, B05D 310

Patent

active

045685711

ABSTRACT:
A mild activation process for the adhesion-activation of polyamide mouldings for electroless metallization comprises treating the substrates, successively or simultaneously, with the solution of a mixture of CaCl.sub.2, LiCl and/or MgCl.sub.2 with AlCl.sub.3, FeCl.sub.3 and/or TiCl.sub.4 in a lower alcohol and with an activator solution based on inorganic complex compounds of the formula

REFERENCES:
patent: 4493861 (1985-01-01), Sirinyan et al.

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