Process for tapering openings in ternary glass coatings

Coating processes – Electrical product produced – Condenser or capacitor

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357 54, 427 89, 427 95, 427 93, 156653, 430314, H01L 21316

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043495842

ABSTRACT:
A process for defining improved tapered openings in glass coatings requires that passivating layers be formed of a doped silicon oxide having a relatively low flow temperature formed on a layer of undoped silicon oxide. After the contact openings are formed, both oxide layers are heated to a temperature below the flow temperature of the doped layer for a period of time sufficient to only soften and partially reflow the doped layer, the temperature being insufficient to form a significant oxide growth on the exposed portion of the semiconductor body.

REFERENCES:
patent: 3481781 (1969-12-01), Kern
patent: 3833919 (1974-09-01), Naber
patent: 3925572 (1975-12-01), Naber
patent: 4091407 (1978-05-01), Williams et al.
patent: 4097889 (1978-06-01), Kern et al.
patent: 4273805 (1981-06-01), Dawson et al.
Y. Tanagaki et al., J. Electrochem. Soc.: vol. 125, No. 3 (1978) "A New Self-Aligned Contact Technology" pp. 471-472.
W. Kern et al., J. Electrochem. Soc.: vol. 117, No. 4 (1970) "Chemical Vapor Deposition . . . Silicon Devices" pp. 562-573.

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