Process for surface treatment of copper product

Chemistry: electrical and wave energy – Processes and products

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29840, 204 20, 204 351, 204 431, 204 40, 204 442, C25D 550

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active

046407472

ABSTRACT:
A process for surface-treating copper products, for example, a copper foil to be used for a copper-clad laminate, the resulting surface-treated copper product having a superior bond strength to a base material, resistant to etching solution, acids, etc., is provided, which process comprises electrically depositing a binary alloy consisting of 95 to 20% by weight of zinc and 5 to 80% by weight of nickel, on the surface of a copper product to form a coating layer, followed by laminating the resulting copper product onto a base material under heating and pressure, said binary alloy being converted during the lamination into a ternary alloy of zinc, nickel and copper constituting a boundary layer having a superior bond strength between the copper product and the base material.

REFERENCES:
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patent: 3857681 (1974-12-01), Yates et al.
patent: 4104134 (1978-08-01), Roberts
patent: 4189331 (1980-02-01), Roy
patent: 4268364 (1981-05-01), Hall
patent: 4376154 (1983-03-01), Nakatsugawa
patent: 4456508 (1984-06-01), Torday et al.
patent: 4469567 (1984-09-01), Torday et al.
patent: 4572768 (1986-02-01), Wolski et al.

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