Process for suppressing electromigration in conducting lines for

Metal working – Method of mechanical manufacture – Electrical device making

Patent

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148 13, 148 203, H01L 21477

Patent

active

043522394

ABSTRACT:
A process for suppressing electromigration in conducting lines formed on integrated circuit structures includes the steps of forming the conducting lines on the integrated circuit structure and heat treating the lines to cause the average grain size in the lines to become larger than the width of the conducting lines.

REFERENCES:
patent: 3848330 (1974-11-01), Hall et al.

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