Process for substrate incorporating component

Details Process for substrate incorporating component Process for substrate incorporating component

2004-03-26

2009-10-27

Coleman, W. David (Department: 2823)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

C438S107000, C361S762000, C257SE25013

Reexamination Certificate

active

07608477

ABSTRACT:
In a process for producing the component-embedded substrate, a first electronic component is connected and fixed onto a first electrode pattern with a conductive bonding material, the first electrode pattern being provided on a first supporting layer. A second supporting layer including a second electrode pattern is press-bonded onto the electronic component-fixed surface of the first supporting layer with a first prepreg therebetween to perform transfer. Then, the first supporting layer and the second supporting layer are separated from the first prepreg. After separation, the first prepreg is cured. A second electronic component is connected and fixed onto the back surface of the second electrode pattern with a conductive bonding material. A third supporting layer including a third electrode pattern is press-bonded onto the second electronic component-fixed surface with a second prepreg therebetween to perform transfer. Then, the third supporting layer is separated from the second prepreg, and the second prepreg is cured. In this manner, the prepregs and electrode patterns are sequentially laminated, thereby reducing the connection resistance between laminated electrode patterns or between an electrode pattern and an electronic component.

REFERENCES:
patent: 5877550 (1999-03-01), Suzuki
patent: 6625037 (2003-09-01), Nakatani et al.
patent: 6931725 (2005-08-01), Sugaya et al.
patent: 2005/0118750 (2005-06-01), Baba et al.
patent: 2005/0186768 (2005-08-01), Sugaya et al.
patent: 2002-076637 (2002-03-01), None
patent: 2002-261449 (2002-09-01), None
patent: 2003-133743 (2003-05-01), None
International Search Report for PCT Application No. PCT/JP2004/004380. International filing date Mar. 26, 2004; mailing date Jul. 13, 2004.

Affiliated with

Also associated with

Rating

Process for substrate incorporating component does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Process for substrate incorporating component, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Process for substrate incorporating component will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-4072484