Electrolysis: processes – compositions used therein – and methods – Electrolytic coating – Treating process fluid by means other than agitation or...
Patent
1998-10-09
1999-08-10
Gorgos, Kathryn
Electrolysis: processes, compositions used therein, and methods
Electrolytic coating
Treating process fluid by means other than agitation or...
205292, 205296, 205297, 205298, C25D 338
Patent
active
059354020
ABSTRACT:
A process and assembly for stabilizing organic additives in an electrolytic solution while electroplating copper. The process includes forming a protective film on a first surface of an anode and minimizing contact between the electrolytic solution and a second surface of the anode which is further from the cathode than the first surface. An anode housing is used to minimize contact between the electrolytic solution and the second surface of the anode. The housing includes two side walls and a bottom wall, each having a groove, and a sealing back plate. The anode is fitted in the grooves such that the first surface of the anode is in contact with the electrolytic solution and the second surface of the anode abuts against the sealing back plate. The anode housing may be used in an electroplating system including the anode housing, a plating tank containing the electrolytic solution, a cathode immersed in the electrolytic solution, and an anode, which preferably is in the shape of a slab.
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Blecker Ira D.
Gorgos Kathryn
International Business Machines - Corporation
Leader William T.
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