Process for soldering and connecting structure

Details Process for soldering and connecting structure Process for soldering and connecting structure

2005-03-29

2005-03-29

Stoner, Kiley S. (Department: 1725)

Metal fusion bonding

Process

With protecting of work or filler or applying flux

C228S256000

Reexamination Certificate

active

06871775

ABSTRACT:
A barrier metal layer is provided on at least one of two electrodes, with one formed on a substrate and the other connected to an electronic component, so as to coat a base material of the electrode, which base material is made of a material containing Cu. Soldering between the electrode of the electronic component and the electrode on the substrate is conducted by supplying a solder material containing Sn and Bi, contacting the solder material with the barrier metal layer while the solder material is in a molten state; and solidifying the solder material. Thereby, when the electronic component is soldered to the substrate with the solder material such as an Sn—Bi based material or an Sb—Ag based material containing Bi, the degradation of a soldering part is avoided, and thus a sufficient thermal fatigue strength of the soldering part is obtained.

REFERENCES:
patent: 4643347 (1987-02-01), Bronnes et al.
patent: 5476211 (1995-12-01), Khandros
patent: 5817188 (1998-10-01), Yahatz et al.
patent: 6049976 (2000-04-01), Khandros
patent: 6083770 (2000-07-01), Sato et al.
patent: 6334570 (2002-01-01), Koshi et al.
patent: 6492585 (2002-12-01), Zamboni et al.
patent: 6548898 (2003-04-01), Matsuki et al.
patent: 6569752 (2003-05-01), Homma et al.
patent: 6689639 (2004-02-01), Sakuyama et al.
patent: 20010020545 (2001-09-01), Eldridge et al.
patent: 20010020546 (2001-09-01), Eldridge et al.
patent: 20020023773 (2002-02-01), Khandros
patent: 20020117330 (2002-08-01), Eldridge et al.
patent: 20020121709 (2002-09-01), Matsuki et al.
patent: 20030022477 (2003-01-01), Hsieh et al.
patent: 20030062398 (2003-04-01), Khandros
patent: 20030116845 (2003-06-01), Bojkov et al.
patent: 20030120959 (2003-06-01), Bohrer et al.
patent: 20030121954 (2003-07-01), Yamaguchi
patent: 20030151141 (2003-08-01), Matsuki et al.
patent: 20030155408 (2003-08-01), Fanti et al.
patent: 20040067604 (2004-04-01), Ouellet et al.
patent: 20040084206 (2004-05-01), Tung
patent: 0 804 058 (1997-10-01), None
patent: 10-41621 (1998-02-01), None
patent: 2001-44615 (2001-02-01), None
patent: 2001-237272 (2001-08-01), None
patent: 2001-284785 (2001-10-01), None
patent: 2002-185131 (2002-06-01), None
patent: 02003198117 (2003-07-01), None

Affiliated with

Also associated with

Rating

Process for soldering and connecting structure does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Process for soldering and connecting structure, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Process for soldering and connecting structure will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3448993