Metal fusion bonding – Process – Plural heat applying
Reexamination Certificate
2008-09-30
2008-09-30
Lorengo, Jerry (Department: 1793)
Metal fusion bonding
Process
Plural heat applying
C228S119000, C228S120000, C228S122100, C228S123100, C228S124500, C228S219000, C228S223000, C228S224000
Reexamination Certificate
active
11012284
ABSTRACT:
A process for soldering an electronic component onto a support which includes at least one heat drain for the component. The method uses a solder paste which incorporates a stripping flux activated at a first temperature, and a solder alloy melted at a second temperature. The process includes preheating the support on the face opposite the component through the heat drain up to the first temperature, placing the component on the support with the solder paste, heating the component by applying a hot gas at a sufficiently high temperature to bring the solder alloy to the melting temperature.
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Chenot José
Glever Bernard
Henry Erick
Barry Erin P
Hispano Suiza
Lorengo Jerry
Oblon & Spivak, McClelland, Maier & Neustadt P.C.
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