Process for soldering an electrocoated substrate

Metal fusion bonding – Process – With protecting of work or filler or applying flux

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228901, 204181, B23K 102, C25D 1306

Patent

active

040250377

ABSTRACT:
A process for soldering a metal substrate coated with an electrodeposited non-peelable coating comprising 35-65 wt parts of methacryl ester, 10-40 wt parts of acrylonitrile, 2-15 wt parts of methacrylic acid, 3-10 wt parts of acrylamide and/or vinyl acetate, in 100 parts of resin.

REFERENCES:
patent: 2930117 (1960-03-01), Wilson
patent: 2963392 (1960-12-01), Dahlgren
patent: 2994676 (1961-08-01), Kucsan et al.
patent: 3362844 (1968-01-01), Christenson et al.
patent: 3471388 (1969-10-01), Koral
patent: 3535293 (1970-10-01), Anderson
patent: 3714078 (1973-01-01), Gordon et al.
patent: 3891526 (1975-06-01), Masuda et al.

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