Process for soldering allowing low ionic contamination without c

Details Process for soldering allowing low ionic contamination without c Process for soldering allowing low ionic contamination without c

1989-08-24

1991-10-01

Heinrich, Samuel M.

Metal fusion bonding

Process

With pretreating other than heating or cooling of work part...

228223, 228259, 148 26, B23K 100, H05K 334

Patent

active

050526120

ABSTRACT:
A process for soldering a substrate surface which allows low ionic contamination without a cleaning operation which comprises (a) applying a stannous fluoride or eutectic mixture thereof to the substrate surface and (b) applying solder to the flux applied in (a). The stannous fluoride which is relatively inactive below its melting temperature can be applied to the substrate surface and the so treated substrate held for an extended period of time prior to soldering without any harmful effect on the substrate. The process is useful in electronic assembly that would include attachment of components to circuit boards, tinning of circuit boards, pretinning of component leads, connectors etc.

REFERENCES:
patent: 2671264 (1954-03-01), Pessel

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