Process for silver plating in printed circuit board manufacture

Details Process for silver plating in printed circuit board manufacture Process for silver plating in printed circuit board manufacture

1997-09-17

1999-09-21

Talbot, Brian K.

Coating processes

Electrical product produced

Integrated circuit, printed circuit, or circuit board

427125, 427304, 427307, 427421, 427405, 427437, 4274431, B05D 512

Patent

active

059551410

ABSTRACT:
In PCB manufacture, the pads and/or through-holes of a bare board are protected prior to mounting of other components by a silver plating process. The silver plate is applied from a plating composition by a replacement process in which silver ions oxidized copper and deposit a layer of silver at the surface. In the aqueous plating composition the silver ions are maintained in solution by the incorporation of a multidentate complexing agent. The compositions may contain a silver tarnish inhibitor and are free of reducing agent capable of reducing silver ions to silver metal, halide ions and substantially free of non-aqueous solvent. Surface mounted components can be soldered direct to the silver coated contact using any commercially available solder. Silver does not deposit onto solder mask, but only onto metal which is less electropositive than silver.

REFERENCES:
patent: 3294578 (1966-12-01), Popeck
patent: 3993845 (1976-11-01), Greenberg et al.
patent: 4067784 (1978-01-01), Leahy et al.
patent: 4777078 (1988-10-01), Miyabayashi
patent: 4908241 (1990-03-01), Quast et al.
patent: 5322553 (1994-06-01), Mandich et al.
Russev, D., Radev, D., and Karaivanow, S. Immersion silvering of copper "1252 Metal Finishing", vol. 81, No. 1 (Jan. 1983), pp. 27-30.
Dimiter Russev, et al., Metal Finishing, 81(1), 1252 (1983).

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