Organic compounds -- part of the class 532-570 series – Organic compounds – Oxygen containing
Patent
1987-03-16
1989-01-03
Lone, Werren B.
Organic compounds -- part of the class 532-570 series
Organic compounds
Oxygen containing
568724, 568749, 568753, C07C 3768
Patent
active
047958294
ABSTRACT:
A process for separating higher molecular weight constituents from phenol polymers, wherein the phenol polymer is dissolved in an organic solvent medium, the solution obtained is mixed at room temperature with ammonia or an amine such that there is a stoichiometric deficiency of ammonia or amine, the precipitate is separate, dried, if appropriate, and treated with aqueous acid, and the resulting sediment is filtered off, washed and dried as described. The starting phenol polymer preferably is a condensation product of optionally substituted phenol and formaldehyde. The process yields fractions possessing an increased osmometric molecular weight, a narrower molecular weight distribution range and an increased glass transition temperature.
REFERENCES:
patent: 2829175 (1958-04-01), Bowman et al.
patent: 2862976 (1958-12-01), Dubbs et al.
patent: 2959622 (1960-11-01), Grimme
patent: 4348471 (1982-09-01), Shelnut et al.
patent: 4507509 (1986-03-01), Mandiratta et al.
patent: 4626605 (1986-12-01), Wojtech et al.
8"Handbook of Chemistry and Physics", pp. D-127-D-149; (1977).
Chemical Abstracts, vol. 68, No. 16, 78918d, Apr. 15, 1968.
Chemical Abstracts, vol. 98, No. 26, 98:225293w, Jun. 27, 1983.
Lambert Gabriele
Schneller Arnold
Hoechst Aktiengesellschaft
Lone Werren B.
LandOfFree
Process for separating higher molecular weight constituents from does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Process for separating higher molecular weight constituents from, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Process for separating higher molecular weight constituents from will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-2169303