Semiconductor device manufacturing: process – Semiconductor substrate dicing
Patent
1997-04-04
1999-03-30
Bowers, Charles
Semiconductor device manufacturing: process
Semiconductor substrate dicing
438 33, 438464, 438948, 437209, 324765, H01L 21304, H01L 2184
Patent
active
058888829
ABSTRACT:
A process for separating electronic devices connected with one another in a body, the process including thinning the side of the body remote from the electronic devices, separating the electronic devices, and testing electrical parameters of the electronic devices after the thinning of the body. The handling of the body is improved by applying to the side of the body containing the electronic devices, prior to the thinning process, an electrically nonconductive auxiliary layer in which respective contact openings are formed above the electronic devices to expose the contact(s) of the respective electronic device.
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Stanley Wolf PhD Silison Processing For The VLSI Era Lattice Press p. 3 figure 1-3, 1990.
Igel Guenter
Mall Martin
Blum David S.
Bowers Charles
Deutsche ITT Industries GmbH
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