Process for separating disk-shaped substrates with the use...

Details Process for separating disk-shaped substrates with the use... Process for separating disk-shaped substrates with the use...

2006-11-08

2011-10-25

Nhu, David (Department: 2895)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

C438S118000, C438S311000, C257SE21014, C257SE21114, C257SE21205, C257SE21212, C257SE21320, C257SE21499

Reexamination Certificate

active

08043890

ABSTRACT:
The present invention relates to a device and a method for dividing up substrates (2) in wafer form (e.g. wafers), which is used in the semiconductor industry, MST (microstructure technology) industry and photovoltaic industry, whereby improved reliability of the process and lower reject rates are accomplished. This object is achieved according to the invention by using adhesion forces that act between the substrates in wafer form and the devices (1) thereby used.

REFERENCES:
patent: 5575868 (1996-11-01), Mann
patent: 6478069 (2002-11-01), Fujisaku et al.
patent: 6821376 (2004-11-01), Rayssac et al.
patent: 7520954 (2009-04-01), Kratzer et al.
patent: 195 81 457 (1999-04-01), None
patent: 199 50 068 (2001-04-01), None
patent: 103 59 732 (2005-07-01), None
patent: 55 096267 (1980-07-01), None
patent: 61 125767 (1986-06-01), None

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