Process for semi-solid forming of thixotropic aluminum-silicon-c

Details Process for semi-solid forming of thixotropic aluminum-silicon-c Process for semi-solid forming of thixotropic aluminum-silicon-c

1997-02-26

1999-03-09

Davis, Robert

Metal treatment

Stock

Aluminum base

420532, 420531, 420529, 420528, 420533, 420534, 420535, 420537, 420538, 148437, C22C 2100

Patent

active

058794786

ABSTRACT:
The invention relates to an aluminum alloy for thixoforming with the composition (by weight): Si: 5%-7.2% Cu: 1%-5% Mg<1% Zn<3% Fe<1.5% other elements<1% each and<3% in total, with % Si<7.5-% Cu/3, which, when reheated to the semisolid state to the point at which a liquid fraction ratio between 35 and 55% is obtained, has an absence of non-remelted polyhedral silicon crystals.

REFERENCES:
patent: 4808374 (1989-02-01), Awano et al.
patent: 5211778 (1993-05-01), Sasaki et al.
patent: 5453244 (1995-09-01), Tanaka et al.

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