Process for self-aligned buried layer, channel-stop, and isolati

Metal working – Method of mechanical manufacture – Assembling or joining

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29571, 29578, 29577C, 29576B, 148 15, 148175, 148188, 148DIG122, 148DIG83, 148DIG35, 148DIG86, 148DIG117, 357 49, 357 59, H01L 2176, H01L 21223, H01L 2131, H01L 2174

Patent

active

045744696

ABSTRACT:
A process is described for producing isolated semiconductor devices in a common substrate which have self-aligned and pre-located isolation walls, buried layers, and channel-stops. The isolation walls are formed from a stacked arrangement of a dielectric region and a non-single crystal semiconductor region, above a doped channel-stop region. A single mask layer determines the location and spacing of the non-single crystal portion of the isolation walls, the channel-stops, and the buried layers.

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