Coating processes – Electrical product produced – Integrated circuit – printed circuit – or circuit board
Patent
1987-09-09
1989-09-12
Beck, Shrive P.
Coating processes
Electrical product produced
Integrated circuit, printed circuit, or circuit board
427313, 427320, 427329, 4273982, B05D 512
Patent
active
048658766
ABSTRACT:
The metal substrate (4) is coated with a coating (6) of another metal of alloy of 4-50 .mu.m thickness by deposition of a molten metal or alloy (5) through a nozzle (2), the melting temperature of this metal or alloy being lower than that of the substrate metal. This coating comports, starting from the substrate, a layer of intermetallic compound of thickness comprised between 0.5 and 4 .mu.m, within a limit not exceeding 40% of the total thickness, the remainder of the coating being formed of the initial coating metal of alloy in a proportion of 97 to 99.5% by weight.
REFERENCES:
patent: 2959829 (1960-11-01), Brennan
patent: 3201275 (1965-08-01), Alplaus
patent: 3468695 (1969-09-01), Federman
patent: 3468770 (1969-09-01), Ghose
patent: 4033398 (1977-07-01), Laithwaite
patent: 4071643 (1978-01-01), Pratt
patent: 4288476 (1981-09-01), Wald
patent: 4310572 (1982-01-01), Stavros
patent: 4596207 (1986-06-01), Witt et al.
patent: 4719962 (1988-01-01), Haour et al.
Boswell Peter
Haour Georges
Richter Dag
Wagnieres Willy
Beck Shrive P.
Dang Vi Duong
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