Process for selective removal of H.sub.2 S from mixtures contain

Details Process for selective removal of H.sub.2 S from mixtures contain Process for selective removal of H.sub.2 S from mixtures contain

1982-01-18

1983-09-20

Thomas, Earl C.

Chemistry of inorganic compounds

Modifying or removing component of normally gaseous mixture

Carbon dioxide or hydrogen sulfide component

423226, 423229, 252189, 252190, B01D 5334, C09K 300

Patent

active

044055838

ABSTRACT:
The selective removal of H.sub.2 S gas from a normally gaseous mixture containing H.sub.2 S and CO.sub.2 is accomplished by contacting the gaseous mixture with an absorbent solution comprising a di-secondary aminoether wherein each amino group has a severely sterically hindered secondary amino moiety whereby H.sub.2 S is selectively absorbed from the mixture.

REFERENCES:
patent: 3398197 (1968-08-01), Miller, Jr. et al.
patent: 3400157 (1968-09-01), Poppelsdorf
patent: 3449432 (1969-06-01), Borstlap et al.
patent: 3478096 (1969-11-01), Cyba
patent: 3962238 (1976-06-01), Mauvernay et al.
patent: 4112051 (1978-09-01), Sartori et al.
patent: 4112052 (1978-09-01), Sartori et al.
patent: 4217238 (1980-08-01), Sartori et al.
patent: 4238206 (1980-12-01), Hong
DeTar, "Effects of Alkyl Groups on Rates of S.sub.n 2 Reactions", Journal of Organic Chemistry, vol. 45, No. 25, Dec. 5, 1980, pp. 5174-5176.
Frazier and Kohl, Ind. and Eng. Chem., 42, No. 11, (1950).
N. M. Khanna et al., Chem. Abs., vol. 49, 1726d, (1955).
W. Reppe, Chem. Abs., vol. 50, 16782b, (1956).

Affiliated with

Also associated with

Rating

Process for selective removal of H.sub.2 S from mixtures contain does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Process for selective removal of H.sub.2 S from mixtures contain, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Process for selective removal of H.sub.2 S from mixtures contain will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-587629