Process for selective masking of III-N layers and for the...

Single-crystal – oriented-crystal – and epitaxy growth processes; – Forming from vapor or gaseous state – With decomposition of a precursor

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C117S092000, C117S104000, C117S108000

Reexamination Certificate

active

07727332

ABSTRACT:
In a process for forming a mask material on a III-N layer, wherein III denotes an element of the group III of the Periodic Table of Elements, selected from Al, Ga and In, a III-N layer having a surface is provided which comprises more than one facet. Mask material is selectively deposited only on one or multiple, but not on all facets. The deposition of mask material may be particularly carried out during epitaxial growth of a III-N layer under growth conditions, by which (i) growth of at least a further III-N layer selectively on a first type or a first group of facet(s) and (ii) a deposition of mask material selectively on a second type or a second group of facet(s) proceed simultaneously. By the process according to the invention, it is possible to produce free-standing thick III-N layers. Further, semiconductor devices or components having special structures and layers can be produced.

REFERENCES:
patent: 4272776 (1981-06-01), Weijland et al.
patent: 5212113 (1993-05-01), Azoulay et al.
patent: 5294565 (1994-03-01), Shiraishi
patent: 6015979 (2000-01-01), Sugiura et al.
patent: 6413627 (2002-07-01), Motoki et al.
patent: 6447604 (2002-09-01), Flynn et al.
patent: 6740906 (2004-05-01), Slater et al.
patent: 6802902 (2004-10-01), Beaumont et al.
patent: 6809351 (2004-10-01), Kuramoto et al.
patent: 6964705 (2005-11-01), Nagai et al.
patent: 7303630 (2007-12-01), Motoki et al.
patent: 2004/0137732 (2004-07-01), Frayssinet et al.
patent: 2005/0092234 (2005-05-01), Motoki et al.
patent: 2005/0194603 (2005-09-01), Slater et al.
patent: 2005/0277218 (2005-12-01), Nakajo et al.
patent: 2006/0264009 (2006-11-01), Wang
patent: 2004-51415 (2004-02-01), None
patent: 2004-55799 (2004-02-01), None
Craven et al., “Threading dislocation reduction via laterally overgrown nonpolar (1120)a-plane GaN”, Applied Physiques Letters, vol. 81, 2002, pp. 1201-1203.
H.M. Ng, “Molecular-beam epitaxy of GaN/AlxGa1-xN multiple quantum wells onR-plane (10ö{umlaut over (v)}{umlaut over (s)}{umlaut over ( )}{umlaut over (1)}2) sapphire substrates”, Applied Physiques Letters, vol. 80, 2002, pp. 4369-4371.
Waltereit et al., “Growth ofM-plane GaN(1100) on γLiA1O2(100)”, Journal of Crystal Growth, 218, 2000, pp. 143-147.
I. Kidoguchi et al., “Air-bridged lateral epitaxial overgrowth of GaN thin films”, Applied Physics Letters, vol. 76, No. 25, 2000, pp. 3768-3770.
Z.R. Zytkiewicz, “Laterally overgrown structures as substrates for lattice mismatched epitaxy”, Thin Solid Films 412, 2002, pp. 64-75.
T.S. Zheleva et al., “Pendeo-Epitaxy versus Lateral Epitaxial Overgrowth of GaN: A Comparative Study via Finite Element Analysis”, Phys. Stat. Sol. (a) 176, 1999, pp. 545-551.
B. Beaumont et al., “Magnesium induced changes in the selective growth of GaN by metalorganic vapor phase epitaxy”, Applied Physics Letters, vol. 72, No. 8, 1998, pp. 921-923.
K. Kawasaki et al., “Formation of GaN nanopillars by selective area growth using ammonia gas source molecular beam epitaxy”, Journal of Crystal Growth 243, 2002, pp. 129-133.
Tomita et al., “Self-Separation of Freestanding GaN from Sapphire Substrates by Hydride Vapor Phase Epitaxy”, Phys. Stat. Sol. (a) 194, No. 2 (2002), pp. 563-567.
Oshima et al., “Fabrication of Freestanding GaN Wafers by Hydride Vapor-Phase Epitaxy with Void-Assisted Separation”, Phys. Stat. Sol. (a) 194, No. 2 (2002), pp. 554-558.
Usui et al., “Role of TiN Film in the Fabrication of Freestanding GaN Wafers Using Hydride Vapor Phase Epitaxy with Void-Assisted Separation”, Phys. Stat. Sol. (a) 194, No. 2 (2002), pp. 572-575.
Bohyama et al., “Freestanding GaN Substrate by Advanced Facet-Controlled Epitaxial Lateral Overgrowth Technique with Masking Side Facets”, Jap. Journal of Appl. Physics, vol. 44, No. 1 (2005), pp. L24-L26.
Hiramatsu et al., “Recent Progress in Selective Area Growth and Epitaxial Lateral Overgrowth of III-Nitrides: Effects of Reactor Pressure in MOVPE Growth”, Phys. Stat. Sol. (a) 176 (1999), pp. 535-543.
Neubert et al., “GaInN quantum wells grown of facets of selectively grown GaN stripes”, Appl. Physcis Letters 87 (2005), pp. 182111-182113.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Process for selective masking of III-N layers and for the... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Process for selective masking of III-N layers and for the..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Process for selective masking of III-N layers and for the... will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-4224895

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.