Process for selective deposition of material on biosensor or...

Details Process for selective deposition of material on biosensor or... Process for selective deposition of material on biosensor or...

2005-02-08

2005-02-08

Smith, Matthew (Department: 2825)

Semiconductor device manufacturing: process

Including control responsive to sensed condition

C438S015000, C438S016000, C438S017000, C438S018000, C438S014000

Reexamination Certificate

active

06852552

ABSTRACT:
A process for selective deposition of material on electrodes of chips made from a single substrate. The process includes forming a plurality of chips on the same substrate. Each chip includes a plurality of electrodes, address pads, and an address area containing the programmed address of the chip. The address areas are connected to the address pads and capable of recognizing the address of the chip to activate the chip. The process also includes establishing electrical connections to connect the address pads and the plurality of electrodes on each chip for the activation of the chips and polarization of the electrodes. Further, the process includes addressing the chips and electrodes on which a first material is to be deposited, and simultaneously depositing the first material on the addressed electrodes of the activated chips. The addressing and deposition steps are repeated as many times as necessary to make material depositions on the other electrodes.

REFERENCES:
patent: 5776791 (1998-07-01), Caillat et al.
patent: 6251595 (2001-06-01), Gordon et al.
patent: 6444111 (2002-09-01), Montgomery
patent: 20030138768 (2003-07-01), Jaffard et al.
patent: 2 741 476 (1997-05-01), None
patent: WO 9801221 (1998-01-01), None

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