Process for securing a microwave module to a support

Details Process for securing a microwave module to a support Process for securing a microwave module to a support

2008-05-27

2008-05-27

Tucker, Philip (Department: 1791)

Adhesive bonding and miscellaneous chemical manufacture

Methods

Surface bonding and/or assembly therefor

C156S307300

Reexamination Certificate

active

07377990

ABSTRACT:
The present invention relates to a process for securing to a metal support at least one microwave electronic module made on a substrate one of whose faces forms an earth plane. The process consists in depositing between the face forming the earth plane and the metal support, at least one strip of conducting adhesive at the level of the zones of breakage of the earth plane. The invention applies to the microwave field.

REFERENCES:
patent: 4242157 (1980-12-01), Gehle
patent: 4616413 (1986-10-01), Iliou et al.
patent: 5049434 (1991-09-01), Wasulko
patent: 5840417 (1998-11-01), Bolger
Search Report dated Feb. 26, 2002.

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