Adhesive bonding and miscellaneous chemical manufacture – Methods – Surface bonding and/or assembly therefor
Patent
1992-08-17
1993-07-27
Simmons, David A.
Adhesive bonding and miscellaneous chemical manufacture
Methods
Surface bonding and/or assembly therefor
156292, 156315, 156322, 156329, 156330, 174 524, 257702, 257704, 257710, B65B 700
Patent
active
052307590
ABSTRACT:
A process for hermetically sealing a cap (7) to a package base (1), on which a semiconductor chip (2) is mounted, by an adhesive resin. First, the base (1) is coated with a thermosetting silicone resin (10) along a frame-shaped abutting portion, then the silicone resin is completely hardened and becomes a silicone rubber, and thereafter, the silicone rubber is coated with a thermosetting sealing resin (11) having a good adhesion with the slicone rubber. The cap is then abutted against the base, and the base and cap are heated while a pressure is exerted thereon to press the base and the cap toward each other.
REFERENCES:
patent: 4109818 (1978-08-01), Hascoe et al.
patent: 4355463 (1982-10-01), Burns
patent: 4534815 (1985-08-01), Hamada et al.
patent: 4861387 (1989-08-01), Matsumoto
patent: 4974057 (1990-11-01), Tazima
patent: 5122862 (1992-06-01), Kajihara et al.
patent: 5167744 (1992-12-01), Maan
IBM Technical Disclosure Bulletin, vol. 29, No. 8, Jan. 1987, p. 3754, "Membrane Solder Seal/Membrane Epoxy Seal".
IBM Technical Disclosure Bulletin, vol. 27, No. 3, Aug. 1984, p. 1701, "Hermetic Seal for Semiconductor Package".
Fujitsu Limited
Osele Mark A.
Simmons David A.
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