Metal fusion bonding – Process – Plural joints
Patent
1985-10-04
1987-01-06
Godici, Nicholas P.
Metal fusion bonding
Process
Plural joints
228260, 228 46, B23K 3102
Patent
active
046340440
ABSTRACT:
This is an article and process which provide the first essentially continuous high tin flow soldering method for attaching copper based fins to copper based tubing. This invention avoids sludge buildup in the reservoir and generally avoids lead carbonate formation when the heat exchanger is in service. In addition, a novel structure is produced having a braze like joint with eta phase layers adjacent to the copper based surfaces. The invention utilizes an essentially lead free, high tin solder cascade onto a preferably cool tube, generally with a limited time of contact between the liquid solder and the tube, and with a combination air quench and wipe to remove excess solder and solidify the remaining solder. Thus a braze like joint is achieved having better heat conduction and closer thermal expansion match. This finned heat exchanger tubing is generally useful for liquid to gas type heat exchangers and especially useful for hydrogen coolers for electrical generators.
REFERENCES:
patent: 1720508 (1929-07-01), Bundy
patent: 2152437 (1939-03-01), Lear
patent: 3426953 (1969-02-01), Metzger et al.
The Soldering of Sheet-Metal Heat Exchangers, Symposium at the College of Advanced Technology, England, Apr. 30, 1965, pp. 6-30.
Metals Handbook, 8th Edition, vol. 8, pp. 428-430, American Society for Metals, 1973.
Hargrove Homer G.
Kratz Jay L.
Sabatino Raymond A.
Weyant Perry A.
Godici Nicholas P.
Heinrich Samuel M.
Satina D. M.
Westinghouse Electric Corp.
LandOfFree
Process for restricted lead content soldering of copper fins to does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Process for restricted lead content soldering of copper fins to , we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Process for restricted lead content soldering of copper fins to will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-678231