Process for removal of undersirable conductive material on a cir

Details Process for removal of undersirable conductive material on a cir Process for removal of undersirable conductive material on a cir

1998-03-06

2000-05-16

Speer, Timothy

Stock material or miscellaneous articles

Structurally defined web or sheet

Discontinuous or differential coating, impregnation or bond

174256, 428647, 428668, 428669, 428457, 428601, 428901, B32B 300, B32B 1504

Patent

active

060634812

ABSTRACT:
A process for removal of undesirable conductive material (e.g., catalyst material and seeped circuit material) on a circuitized substrate and the resultant circuitized substrates disclosed. Such process and resultant circuit effectively address the electrical shorting problems caused by nonremoval of the residual catalyst material and circuit material which has seeped under the residual catalyst material. The process includes the steps of: a) providing a catalyst layer (e.g., palladium and tin) having circuit pattern (e.g., copper) thereon; b) pretreating the catalyst layer and the circuit pattern (e.g., with a cyanide dip) for removal of undesirable portions of each which cause electrical leakage between circuit lines of the circuit pattern; c) oxidizing the catalyst layer and the circuit pattern (e.g., with chlorite, permanganate, hydrogen peroxide, or air at a temperature elevated above ambient conditions); and d) removing the undesirable portions of the catalyst layer and the undesirable portions of the circuit pattern (e.g., with a cyanide submersion). The resultant circuitized substrate includes a circuit pattern on a catalyst layer wherein undesirable portions of the catalyst layer and circuit pattern are completely removed between the circuit features of the circuit pattern so that electrical leakage between the circuit features does not occur.

REFERENCES:
patent: 4144118 (1979-03-01), Stahl
patent: 4430154 (1984-02-01), Stahl et al.
patent: 4632857 (1986-12-01), Mallory, Jr.
patent: 4718972 (1988-01-01), Babu et al.
patent: 4874635 (1989-10-01), Karas et al.
patent: 5009714 (1991-04-01), Arrington et al.
patent: 5084299 (1992-01-01), Hirsch et al.
patent: 5213841 (1993-05-01), Gulla et al.
patent: 5302492 (1994-04-01), Ott et al.

Affiliated with

Also associated with

Rating

Process for removal of undersirable conductive material on a cir does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Process for removal of undersirable conductive material on a cir, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Process for removal of undersirable conductive material on a cir will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-256844